Reuters exclusively reported that Taiwan’s TSMC is looking at building advanced packaging capacity in Japan, a move that would add momentum to Japan’s efforts to reboot its semiconductor industry.
Technology
TSMC considering advanced chip packaging capacity in Japan
17 March 2024, 3:23 pm 1 minute
Market Impact
Japan is seen as well positioned to take a larger role in advanced packaging given that it has leading semiconductor materials and equipment makers, growing investment in chip fabrication capacity and a solid customer base.
Article Tags
Topics of Interest: Technology
Type: Reuters Best
Sectors: Technology
Regions: Asia
Countries: JapanTaiwan
Win Types: Exclusivity
Story Types: Exclusive / Scoop
Media Types: Text
Customer Impact: Important Regional Story
